Timeline for PCB: How to Keep Long Shared Bus from Ringing?
Current License: CC BY-SA 4.0
4 events
| when toggle format | what | by | license | comment | |
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| Nov 18 at 17:56 | comment | added | Giordino | @PeteW, I thought so as well. I think that's the critical data point. So, if I can get the best of both worlds (the reasonably good 2 layer, and a helpful application of the 2 added inner layers), that would be ideal. I think the answer is probably simple, it just eludes me. The real solution may be to print a few boards with different ground pour arrangements and try it out. But I'll wait for the guidance of the group here. | |
| Nov 18 at 13:16 | comment | added | Pete W | @Giordino , that's an interesting clue as well, if the problem appeared after adding layers | |
| Nov 18 at 6:41 | comment | added | Giordino | Thanks for the input. That does make sense. This design actually worked much better when it was a 2 layer board, before I added the inner layers of ground pour. I believe I can get performance to an acceptable level simply by manipulating the copper, given the right stackup and layout. | |
| Nov 18 at 6:30 | history | answered | Whit3rd | CC BY-SA 4.0 |