A Bit About Memory HBM4E Raises The Bar For AI Memory Bandwidth
The speed at which accelerators can be fed with data has become just as criti...
March 12, 2026
Best Of Both: LP & HP Human-Centered Agentic AI Comes To RTL Verification
The long-term objective is to let engineers spend more time on what really ma...
March 12, 2026
At The Core Rethinking Voice AI At The Edge: A Practical Offline Pipe...
Achieve low-latency, human-like dialogue without sending data outside the loc...
March 12, 2026
Everything Low Power Serial Wire Debug (SWD) Protocol: Efficient Debug Interfa...
A compact, two-pin interface provides efficient access to debug and trace fea...
March 12, 2026
IP And LP In SoCs Customizing Foundation IP For Ultra-Low-Voltage Designs
A case study on adapting memory compilers and logic libraries for power-criti...
March 12, 2026
Embedded ML Design The On-Device LLM Revolution
Why 3B to 30B models are moving to the edge — and what that means for silicon.
February 20, 2026
MIPI And Beyond Exploring The Latest Innovations In MIPI D-PHY And MIPI C...
Enhanced performance and flexibility for the next generation of high-speed ...
January 15, 2026
Inside Edge AI Processing Next Generation AI: Transitioning Inference From The Clou...
High utilization, low memory movement, and broad model compatibility can coex...
December 11, 2025
Making Hybrid Bonding Better
Why this technology is so essential for multi-die assemblies, and how it can be improved.
Backside Power Delivery Creates Fab Tool, Thermal Dissipation Barriers
Moving the power delivery network to the backside of a chip reduces congestion, but it introduces new challenges for fabs.
New Automotive Architectures Are Shaking Up Processor And Memory Choices
Exponential increases in data and a mix of performance requirements are driving a top-to-bottom rethinking of what works best where.
Chip Industry Week In Review
Rapidus' new $1.7B infusion; Intel and UMC leadership moves; faster EUV; $100B GPU deal; Arm-Tensor robocar; smartphone market to decline; HBF; $1B in AI chip funding; imec's mCFET study; monolithically stackable 1T1C 3D DRAM; automotive edge; Yongin cluster opening moved up; robovacuum hack; chip industry earnings.
Advanced Packaging Limits Come Into Focus
Mechanical and process control limits are now shaping what can be manufactured at scale.
