tag: Expedera

AI Power on the Edge
By Brian Bailey - 12 Mar, 2026 - Comments: 0

Key takeaways Power and thermal become primary design considerations, not just optimizations. Hardware architectures need to be developed from the ground up. Hardware/software/model co-development is essential. Implementing AI on the edge is driven by a different set of metrics than training or even inference in the cloud. It makes power a first-class citizen, if not the mos... » read more

Security in Data Centers for AI Applications
By Expedera - 11 Mar, 2026 - Comments: 0

AI data centers are the engines of the new data revolution, transforming data lakes and extracting meaningful insights guided by user queries. In this white paper, we revisit the security problem and highlight that AI data centers pose specific risks whose impact extends far beyond initial expectations. Starting from the premise that the AI is “only as good as the data that comes in/out”, w... » read more

Minimum Energy Per Query
By Brian Bailey - 12 Feb, 2026 - Comments: 1

Key Takeaways Extracting heat from a chip faster is a short-term fix to a bigger problem. The longer-term challenge is how to reduce the amount of energy used per query. Data movement, guardbanding, and software inefficiency are key targets for the future. Heat is a serious problem within AI chips, and it is limiting how much processing can be done. The solution is either to... » read more

Future-Proofing System Design
By Expedera - 11 Feb, 2026 - Comments: 0

This whitepaper has explored how converging forces—AI-driven workloads, heterogeneous integration, and increasingly complex security requirements—are transforming design priorities. Adaptability, openness, and lifecycle management are no longer secondary considerations but core architectural imperatives. Standardization through initiatives such as UCIe and OCP fosters interoperability and s... » read more

Balancing Training, Quantization, And Hardware Integration In NPUs
By Ann Mutschler - 26 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML is driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down to discuss this with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Qu... » read more

Chip Industry Week In Review
By The SE Staff - 23 Jan, 2026 - Comments: 0

TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Addressing Critical Tradeoffs In NPU Design
By Ann Mutschler - 21 Jan, 2026 - Comments: 1

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven W... » read more

How And Why To Optimize NPUs
By Ann Mutschler - 15 Jan, 2026 - Comments: 0

Experts At The Table: AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones.  Semiconductor Engineering sat down with Jason Lawley, director of product marketing, AI IP at Cadence; Sharad Chole, chief scientist and co-founder at Expedera; Steve Roddy, chief marketing officer at Quadric; Steven... » read more

Next Generation AI: Transitioning Inference From The Cloud To The Edge
By Paul Karazuba - 11 Dec, 2025 - Comments: 0

AI inference deployments are increasingly focused on the edge as manufacturers seek the consistent latency, enhanced privacy, and reduced operational costs they can’t achieve in cloud-based deployments. While cloud-based platforms provide incredible computational power and enable widely adopted services, the dependence on network connectivity inherently creates variability, cost and security ... » read more

Chiplets Vs. Soft IP: Different In Almost Every Way
By Bryon Moyer - 11 Dec, 2025 - Comments: 2

Chiplets serve a similar function as the soft IP widely used in chips today, but the similarities end there. While both can speed time to market and enable design teams to focus limited resources where they can best be applied, the implementation, manufacturing, test, and long-term business requirements wrought by a chiplet marketplace would be very different. Soft IP (also known as RTL IP) ... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy