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Through hole PCB pads need an annular ring and will have other details like the solder mask clearance. For pad that shall be used to solder component leads, I believe that there is some IPC guidance on the annular ring size and hole size for given component lead diameter. Does anyone know what IPC standard this is?

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I think both IPC-2222 and IPC-2221

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  • \$\begingroup\$ Could you guide me to specific section in case you are aware of it? I shall search for these on google. \$\endgroup\$ Commented Jul 11, 2023 at 19:33
  • \$\begingroup\$ I linked the tables of content on the official website. \$\endgroup\$ Commented Jul 11, 2023 at 19:35

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