Through hole PCB pads need an annular ring and will have other details like the solder mask clearance. For pad that shall be used to solder component leads, I believe that there is some IPC guidance on the annular ring size and hole size for given component lead diameter. Does anyone know what IPC standard this is?
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- \$\begingroup\$ Could you guide me to specific section in case you are aware of it? I shall search for these on google. \$\endgroup\$quantum231– quantum2312023-07-11 19:33:48 +00:00Commented Jul 11, 2023 at 19:33
- \$\begingroup\$ I linked the tables of content on the official website. \$\endgroup\$Spehro 'speff' Pefhany– Spehro 'speff' Pefhany2023-07-11 19:35:07 +00:00Commented Jul 11, 2023 at 19:35